Intel to build a ‘continuum’ of computing

By RED R. SAMAR
October 4, 2009, 1:55pm
INTEL CEO Paul Otellini shows to IDF 2009 delegates a silicon wafer containing the world's first working chips built on 22nm manufacturing technology.
INTEL CEO Paul Otellini shows to IDF 2009 delegates a silicon wafer containing the world's first working chips built on 22nm manufacturing technology.

Intel CEO Paul Otellini said the chip-making giant intends to build a "continuum" of computing experiences where computing devices – ranging from embedded systems to handhelds to traditional PC clients to servers – all work together in a seamless and familiar fashion that will ultimately redefine the playing field between industries and break down the barriers that exist today to expand the boundaries of what's possible inside computing.

"There is an incredible transformation taking place in our industry. The world of computing is expanding beyond the personal computer to a much bigger space with Intel Architecture poised to be at the center of it," he said.

In his keynote address at the opening of the annual Intel Developer Forum (IDF) 2009 held in San Francisco, Otellini cited that over the past several years Intel has been developing Intel Architecture solutions that increasingly address opportunities beyond the PC.

"We call these a spectrum," Otellini says.

Inside this spectrum, he added, What Intel envisions is to deliver is the same personal computing experience across any device. Now, building these devices is one thing, he explained, gluing them all together is another matter. Otellini says that while Moore's Law is very, very predictable, the continuum on the otherhand is not, adding that the nature of the products that they enable, and are going to then make possible, are really limitless.

Otellini said that for quite some time, Intel have been focused on are things like speed, size and battery life. Although those are still important, he argues, however increasingly the differentiation has now come around to things like bandwidth, user interfaces, social networking, and even tweets.

Intel's top honcho said that there are three essential technology ingredient that would allow them to build this continuum. First and foremost is Moore's Law, the basic silicon capability that drives it all. Secondly, the platform architectures that take advantage of that silicon technology and embed new functionality into devices. And lastly, the software, the software that makes it real and that brings it to the end-user in a way that is friendly and easy to use.

"At Intel, Moore's Law is alive and thriving," Otellini says. "Two years ago, we introduced the world's first 45-nanometer high-k metal gate silicon technology. But we're going beyond that, we're not stopping at 45. Our next generation is 32 nanometers and we've begun production of the world's first 32nm microprocessor, which is also the first high-performance processor to integrate graphics with the CPU," he said.

By continuing to lead in manufacturing technology Intel he said is able to innovate and integrate new features and functions into its processors. Otellini said Intel's 32nm process is now certified and Westmere processor wafers are moving through the factory in support of planned fourth quarter revenue production. Following the move to 32nm Intel he said will subsequently introduce Sandy Bridge, Intel's next new microarchitecture. Sandy Bridge will feature a sixth generation graphics core on the same die as the processor core and includes AVX instructions for floating point, media, and processor intensive software.

At this point in his keynote, Otellini previewed a world's first by displaying a silicon wafer containing the world's first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory as well as logic circuits to be used in future Intel microprocessors. It is made up of individual die containing 364 million bits of SRAM memory and has more than 2.9 billion transistors packed into an area the size of a fingernail. The chips contain the smallest SRAM cell used in working circuits ever reported at .092 square microns. The devices rely on a third-generation high-k metal gate transistor technology for improved performance and lower leakage power.

Otellini said by continuing to drive the pace of innovation, Intel is addressing the needs of entirely new market segments including netbooks, handhelds, consumer electronics and embedded applications. "Intel Core and Atom-based processors have generated unprecedented excitement and opportunities in our key growth areas," Otellini said.

He explained that to build on this momentum, the Santa Clara, California-based tech titan is working on ways to create a seamless Internet experience for people across all their computing devices.

Otellini announced to more than 4,000 attendees of IDF a new program that they have created to encourage development of software applications that can be written once, but run on Windows and Moblin devices – that will enable software developers to expand their reach to more devices and consumers.

Called the Intel Atom Developer Program, it provides a framework for independent software vendors (ISVs) and software developers to create and sell applications for netbooks and other Intel Atom processor-based products. To broaden application availability across platforms, the program will support multiple operating systems and run-time environments. Run-time environments enable developers to use a single code base to support various device platforms without massive reprogramming, reducing cost and time to market.

Initially Intel will be working with partners, such as netbook OEMs ACER and Asus, to create application storefronts in which validated software applications will be sold.

Meanwhile, in the embedded market segment, the Atom processor is driving advanced technology into new areas from hospital patient monitoring to avionics applications to audio systems. The company currently has 460 embedded Atom design wins including Harman International Industries. The provider of a wide range of audio and infotainment products for vehicles, Harman International has announced new in-car devices based on the Atom core that will enable full Internet access, 3-D navigation, brilliant graphics and high-speed wireless connectivity.

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